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Free shipping intle X3470 Quad Core 2.93GHz LGA 1156 95W 8M Cache Desktop CPU scrattered pieces
Intel Xeon X3470 specifications
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General information Type Market segment Server Family
Model number
CPU part numbers
BV80605001905AJ is an OEM/tray microprocessor BX80605X3470 is a boxed microprocessor Frequency 2933 MHz Maximum turbo frequency 3600 MHz (1 core)
3467 MHz (2 cores)
3200 MHz (3 or 4 cores) Bus speed 2.5 GT/s DMI Clock multiplier 22 Package 1156-land Flip-Chip Land Grid Array (FC-LGA8)
1.48" x 1.48" (3.75 cm x 3.75 cm) Socket Introduction date End-of-Life date Last order date is December 28, 2012
Last shipment date for tray processors is December 6, 2013 Price at introduction $589 S-spec numbers Part number ES/QS processors Production processors
BV80605001905AJ + + BX80605X3470
+ Architecture / Microarchitecture Microarchitecture Nehalem Platform Foxhollow-WS Processor core Core stepping B1 (Q3AK, SLBJH) CPUID 106E5 (SLBJH) Manufacturing process 0.045 micron
774 million transistors Die 296mm 2 Data width 64 bit The number of CPU cores 4 The number of threads 8 Floating Point Unit Integrated Level 1 cache size 4 x 32 KB 4-way set associative instruction caches
4 x 32 KB 8-way set associative data caches Level 2 cache size 4 x 256 KB 8-way set associative caches Level 3 cache size 8 MB 16-way set associative shared cache Physical memory 32 GB Multiprocessing Uniprocessor Extensions and Technologies MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit HT / Hyper-Threading technology VT-x / Virtualization technology VT-d / Virtualization for directed I/O TBT / Turbo Boost technology TXT / Trusted Execution technology Low power features Thread C1/C1E, C3 and C6 states Core C1/C1E, C3 and C6 states Package C1/C1E, C3 and C6 states Enhanced SpeedStep technology Integrated peripherals / components Integrated graphics None Memory controller The number of controllers: 1
Memory channels: 2
Supported memory: DDR3-800, DDR3-1066, DDR3-1333
Maximum memory bandwidth (GB/s): 21.3
ECC supported: Yes Other peripherals Direct Media Interface PCI Express 2.0 interface Electrical / Thermal parameters V core 0.65V - 1.4V Maximum operating temperature 72.7°C Maximum power dissipation 189.78 Watt (peak)
160.08 Watt (sustained) Thermal Design Power 95 Watt
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